Appointment: manufacturing of film current–carrying and resistive elements of integrated microcircuits by a method magnetron dispersions.
Field of application: microelectronics.
Manufacturing method: gas-plasma sputtering, pressing and sintering, moulding,
machining.
Overall dimensions: Ø (46–225) x (6–24) mm;
114 x 264 x (2–15) mm;

Advantages - factor of stability of electric properties of thin films is no more than 0,01;
specific resistance of resistive films – 0,5–1,5 kΩ/, TKR of resistive films 1–10(-4)/K.