Manufacturing of silicon plates for integrated microcircuits; removal fastdiffusing
impurity from active areas of Integrated microcircuits.
Field of application:
Microelectronics.
Developed tools:
The cutting tool and recommendations with the account crystallographic factors for
silicon plates of orientation (001) and (111)
on:
-mode of ingot cutting of monocrystal silicon on plates;
mode of laser getter I ng fast–diff using impurity.

-methods of cutting allow to receive more uniform distribution and considerable
decrease in depth of the broken layers to surfaces of cut off plates, to improve
geometrical parameters – to reduce a deflection and to eliminate a surface micro–wavlness;
-gettering methods of impurity allow to form gettering the high-capacity areas
excluding an exit of dispositions on a working surface of plates, to raise an exit of suitable semiconductor structures.